The new Ascent series heatsink with eVCI provides an extremely conductive thermal path from the DRAM that is ten times more conductive than solid copper for a high technology boost to performance and overhead.
enhanced Vapor Chamber Interface
Copper enhanced Vapor Chamber Interface (eVCI) provides an extremely conductive thermal path from the DRAM (10X better than solid copper)
Highly conductive 6063 extruded aluminum alloy encasement for effective heat exchange through convection
Low profile and slim width design for full population of memory slots if desired. Won’t interfere with most large CPU heatsinks
Sleek and aggressive design compliments any build’s appearance
