'Look Ma, I'm liquid cooling...no water pump!'
The Ascent™ is the most revolutionary advancement in memory cooling technology ever. Without the need for a water pump, hosing and a reservoir, Ascent™ enables you to liquid-cool your memory.
How It Works
The Ascent™ uses a patented multi-layer copper heatpipe, housed in an extruded aluminium heatsink (see cross-section on right). This heatpipe consists of three chambers: two fluid, one vapor. The vapor chamber is sandwiched between the fluid chambers, acting as a superhighway for the heat emanating from your memory module. The result? The most effective self-contained heatsink in existence.
Below, you can see the Ascent™ in its individual parts:
(click above to zoom)